14 Layer FR4 TG170 HDI PCB With Stack Via And 3mil Trace And Gap

14 Layer FR4 TG170 HDI PCB With Stack Via And 3mil Trace And Gap

Specification:

Applications:

Communications
Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.

Computer Peripherals
High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.

Consumer
Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.

Automotive
Passenger safety systems, engine control systems, air bags, traction control products, etc.

High End Computing and Storage
High performance computer and server, mainframe system and storage equipment, memory, etc.

Industry
Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc

Medical
Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.

Military
Satellite, radar, airplane, control unit, communication equipment .etc.

Test & Measurement
Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.

Competitive Advantage: